|Model Number||T862 220V|
|Package Weight||9.0kg (19.84lb.)|
|Package Size||20cm x 30cm x 30cm (7.87in x 11.81in x 11.81in)|
T862 220V IRDA SMD&BGA Rework Station Infrared Heating 1. Packing list 1PCS Welder base 1PCS Guide rod 1PCS Locating ring 1PCS Lamp assy 1PCS Circuit Board(PCB) support 1PCS Power Cable 1PCS Soldering iron 1PCS Soldering iron support 1PCS User manual 2. Features It Can suitable for all of the component, especially Micro BGA component. (1)Use of infrared welding technology which is developed independently. (2)Use of an infrared heat lamp. Heat is easy to pierce and distribute evently,which overcome disadvantage (burn out elements) of traditional welding machines. (3)Easy operation. You just need one-day training and you can operate it skillfully. (4)No need for unsolder tools. IRDA Welder T-862 can unsolder all the elements between 05 and 20mm. (5)This machine has 650W hot-melt system .Its preheating area is 80x120mm. (6)Infrared heating without heated air flowing .No impact on circumjacent small elements. It is suitable for the elements, especially Micro BGA elements. 3.Parameter Working voltage AC220V 50HZ(Standard),110V 60Hz(Optional, other buy link) Output power 650W Temperature 100°C - 350°C Preheating area 80mm*120mm Heating Infrared lamp heating Lamp diameter size 15mm 4. P ictures
5. Operation method
Turn on the power switch, then use self-checking first (The previous setting value demonstrated on the keyboard display monitor after you turn on the machine).
Put PCB on the corresponding notch in PCB support, and adjust the pinch nuts of locating ring and focusing support, then adjust the height of infrared lamp body, the ideal height between lamp and the unsoldering article is 20-30mm.
Select the suitable heating temperature. Select the suitable heating temperature of infrared lamp between 60-350℃, according to the chip size that need to be unsoldered. When you unsolder chips which are about
15x15mm, you adjust the infrared lamp’s temperature to 240-300? When IRDA SMD & BGA Rework Station T862 User Manual unsoldering chips which are about 30x30mm, you adjust the infrared lamps temperature at 300-350?. The infrared ray lights directly, infrared ray is the strongest when the temperature is up to 350? (you need pay attention to the timing, and prevent from burning out the chip).
Adjust the focus. The minimum focal diameter of infrared lamp body is 15mm; the maximum is above 30mm, adjust them according to different chips. Usually, the ideal height between lamp and the chip is 20-30mm.
Adjust the focusing knob by the size of the chip. Ideally, the bright spot should cover the whole chip.
Turn on the two switches on the front panel for the preheating plate and the infrared lamp.
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